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Aerospace Instrument-Making

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THE METHOD OF A PRIORI ANALYSIS OF THERMAL PROCESSES OF SPACE EQUIPMENT ELECTRONIC UNITS
Y.N. Kofanov, N.A. Meleh, S.Y. Sotnikova

The authors describe the developed method of a priori analysis of the thermal loads of electronic components caused by thermal processes occurring in printed circuit assemblies of the electronic units of spacecraft. The method allows the developer to conduct studies of the thermal regimes at the stages of the preliminary and technical design and obtain the values of thermal loads on the electronic components of the printed circuit assemblies prior to the production of the prototype. In case of overloading of a specifi c electronic component (or components), the developer applies one of the cooling options and conducts the verifi cation simulation. In the study of thermal conditions, the authors introduce load factors, which are set taking into account the reserves for random variations of the parameters of electronic components and materials of bearing structures. The application of the method is illustrated by the example of providing the required thermal regime of an electronic computing unit installed on a satellite.
Key words: modeling; design; electronic components; thermal load; heat exchange; space equipment.


DOI: 10.25791/aviakosmos.08.2018.098

Contacts: E-mail: yurykofanov@yandex.ru

Pp. 25-34.

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